"High-speed digital design challenges are growing at an incredible rate, especially in applications using higher performance data interconnects," said the test firm.
The aim is to cover high speed data design challenges fom early design to prototype validation.
This will include signal integrity challenges in high-speed digital links and how those effects can be anticipated and reduced.
FPGA supplier Xilinx will join the tour to address FPGA-specific signal integrity challenges.
“Agilent and Xilinx have collaborated for several years now and we share a common viewpoint with a robust methodology set up that includes IBIS AMI model generation," said Shamree Howard, high-speed digital programme manager for Agilent.
“Designers are looking for powerful FPGAs and associated tools to meet their multigigabit challenges,” said Giles Peckham, European marketing director for Xilinx.
“Agilent offers a complete integrated and correlated flow solution spanning design, board characterization, signal capture, protocol analysis, stress analysis and automated compliance verification," said Peckham.
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